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| PMBT3904M 40 V, 200 mA NPN switching transistor Rev. 01 -- 21 July 2009 BOTTOM VIEW Product data sheet 1. Product profile 1.1 General description NPN single switching transistor in a SOT883 (SC-101) leadless ultra small Surface-Mounted Device (SMD) plastic package. PNP complement: PMBT3906M. 1.2 Features I Single general-purpose switching transistor I Board-space reduction I Ultra small SMD plastic package 1.3 Applications I General-purpose switching and amplification 1.4 Quick reference data Table 1. Symbol VCEO IC hFE Quick reference data Parameter collector-emitter voltage collector current DC current gain VCE = 1 V; IC = 10 mA Conditions open base Min 100 Typ 180 Max 40 200 300 Unit V mA 2. Pinning information Table 2. Pin 1 2 3 Pinning Description base emitter collector 1 3 2 Transparent top view 1 2 sym021 Simplified outline Graphic symbol 3 NXP Semiconductors PMBT3904M 40 V, 200 mA NPN switching transistor 3. Ordering information Table 3. Ordering information Package Name PMBT3904M SC-101 Description leadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.5 mm Version SOT883 Type number 4. Marking Table 4. Marking codes Marking code 6P Type number PMBT3904M 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VCBO VCEO VEBO IC ICM IBM Ptot Tj Tamb Tstg [1] [2] [3] Parameter collector-base voltage collector-emitter voltage emitter-base voltage collector current peak collector current peak base current total power dissipation junction temperature ambient temperature storage temperature Conditions open emitter open base open collector single pulse; tp 1 ms single pulse; tp 1 ms Tamb 25 C [1][2] [1][3] Min -55 -65 Max 60 40 6 200 200 100 260 590 150 +150 +150 Unit V V V mA mA mA mW mW C C C Reflow soldering is the only recommended soldering method. Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2. PMBT3904M_1 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 -- 21 July 2009 2 of 11 NXP Semiconductors PMBT3904M 40 V, 200 mA NPN switching transistor 800 Ptot (mW) (1) 006aab602 600 400 (2) 200 0 -75 -25 25 75 125 175 Tamb (C) (1) FR4 PCB, mounting pad for collector 1 cm2 (2) FR4 PCB, standard footprint Fig 1. Power derating curves SOT883 (SC-101) 6. Thermal characteristics Table 6. Symbol Rth(j-a) Thermal characteristics Parameter thermal resistance from junction to ambient Conditions in free air [1][2] [1][3] Min - Typ - Max 481 212 Unit K/W K/W [1] [2] [3] Reflow soldering is the only recommended soldering method. Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2. PMBT3904M_1 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 -- 21 July 2009 3 of 11 NXP Semiconductors PMBT3904M 40 V, 200 mA NPN switching transistor 103 duty cycle = Zth(j-a) (K/W) 102 1 0.75 0.5 0.33 0.2 0.1 0.05 0.02 10 0.01 0 006aab603 1 10-5 10-4 10-3 10-2 10-1 1 10 102 tp (s) 103 FR4 PCB, standard footprint Fig 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values 7. Characteristics Table 7. Characteristics Tamb = 25 C unless otherwise specified. Symbol ICBO IEBO hFE Parameter Conditions Min Typ Max 50 50 Unit nA nA collector-base cut-off VCB = 30 V; IE = 0 A current emitter-base cut-off current DC current gain VEB = 6 V; IC = 0 A VCE = 1 V IC = 0.1 mA IC = 1 mA IC = 10 mA IC = 50 mA IC = 100 mA VCEsat VBEsat td tr ton ts tf toff Cc PMBT3904M_1 60 80 100 60 30 650 - 180 180 180 105 50 75 120 750 850 - 300 200 300 850 950 35 35 70 200 50 250 4 mV mV mV mV ns ns ns ns ns ns pF collector-emitter saturation voltage base-emitter saturation voltage delay time rise time turn-on time storage time fall time turn-off time IC = 10 mA; IB = 1 mA IC = 50 mA; IB = 5 mA IC = 10 mA; IB = 1 mA IC = 50 mA; IB = 5 mA VCC = 3 V; IC = 10 mA; IBon = 1 mA; IBoff = -1 mA collector capacitance VCB = 5 V; IE = ie = 0 A; f = 1 MHz Rev. 01 -- 21 July 2009 (c) NXP B.V. 2009. All rights reserved. Product data sheet 4 of 11 NXP Semiconductors PMBT3904M 40 V, 200 mA NPN switching transistor Table 7. Characteristics ...continued Tamb = 25 C unless otherwise specified. Symbol Ce fT NF Parameter emitter capacitance transition frequency noise figure Conditions VEB = 500 mV; IC = ic = 0 A; f = 1 MHz VCE = 20 V; IC = 10 mA; f = 100 MHz VCE = 5 V; IC = 100 A; RS = 1 k; f = 10 Hz to 15.7 kHz Min 300 Typ Max 8 5 Unit pF MHz dB 600 hFE 006aab115 0.20 IB (mA) = 5.0 IC (A) 0.15 4.0 3.0 2.0 1.0 006aab116 4.5 3.5 2.5 1.5 400 (1) 0.10 0.5 200 (2) 0.05 (3) 0 10-1 1 10 102 IC (mA) 103 0.0 0 2 4 6 8 10 VCE (V) VCE = 1 V (1) Tamb = 150 C (2) Tamb = 25 C (3) Tamb = -55 C Tamb = 25 C Fig 3. DC current gain as a function of collector current; typical values Fig 4. Collector current as a function of collector-emitter voltage; typical values PMBT3904M_1 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 -- 21 July 2009 5 of 11 NXP Semiconductors PMBT3904M 40 V, 200 mA NPN switching transistor 1.2 VBE (V) (1) 006aab117 1.3 VBEsat (V) 0.9 (1) (2) 006aab118 0.8 (2) (3) 0.4 0.5 (3) 0 10-1 1 10 102 IC (mA) 103 0.1 10-1 1 10 102 IC (mA) 103 VCE = 1 V (1) Tamb = -55 C (2) Tamb = 25 C (3) Tamb = 150 C IC/IB = 10 (1) Tamb = -55 C (2) Tamb = 25 C (3) Tamb = 150 C Fig 5. Base-emitter voltage as a function of collector current; typical values 1 Fig 6. Base-emitter saturation voltage as a function of collector current; typical values 006aab119 VCEsat (V) 10-1 (2) (1) (3) 10-2 10-1 1 10 102 IC (mA) 103 IC/IB = 10 (1) Tamb = 150 C (2) Tamb = 25 C (3) Tamb = -55 C Fig 7. Collector-emitter saturation voltage as a function of collector current; typical values PMBT3904M_1 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 -- 21 July 2009 6 of 11 NXP Semiconductors PMBT3904M 40 V, 200 mA NPN switching transistor 8. Test information VBB VCC RB oscilloscope VI R1 (probe) 450 R2 RC Vo (probe) 450 DUT oscilloscope mlb826 VI = 5 V; t = 600 s; tp = 10 s; tr = tf 3 ns R1 = 56 ; R2 = 2.5 k; RB = 3.9 k; RC = 270 VBB = -1.9 V; VCC = 3 V Oscilloscope: input impedance Zi = 50 Fig 8. Test circuit for switching times 9. Package outline 0.62 0.55 0.55 0.47 0.30 0.22 3 0.50 0.46 0.65 0.30 0.22 0.20 0.12 0.35 Dimensions in mm 1.02 0.95 2 1 03-04-03 Fig 9. Package outline SOT883 (SC-101) PMBT3904M_1 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 -- 21 July 2009 7 of 11 NXP Semiconductors PMBT3904M 40 V, 200 mA NPN switching transistor 10. Packing information Table 8. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number PMBT3904M [1] Package Description SOT883 2 mm pitch, 8 mm tape and reel Packing quantity 10000 -315 For further information and the availability of packing methods, see Section 14. 11. Soldering 1.3 0.7 R0.05 (12x) solder lands solder resist 0.9 0.25 (2x) 0.6 0.7 solder paste occupied area 0.3 (2x) 0.4 (2x) 0.3 0.4 sot883_fr Dimensions in mm Fig 10. Reflow soldering footprint SOT883 (SC-101) PMBT3904M_1 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 -- 21 July 2009 8 of 11 NXP Semiconductors PMBT3904M 40 V, 200 mA NPN switching transistor 12. Revision history Table 9. Revision history Release date 20090721 Data sheet status Product data sheet Change notice Supersedes Document ID PMBT3904M_1 PMBT3904M_1 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 -- 21 July 2009 9 of 11 NXP Semiconductors PMBT3904M 40 V, 200 mA NPN switching transistor 13. Legal information 13.1 Data sheet status Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 13.2 Definitions Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control -- This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data -- The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 13.3 Disclaimers General -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental 13.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 14. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com PMBT3904M_1 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 -- 21 July 2009 10 of 11 NXP Semiconductors PMBT3904M 40 V, 200 mA NPN switching transistor 15. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 12 13 13.1 13.2 13.3 13.4 14 15 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 Thermal characteristics. . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7 Packing information. . . . . . . . . . . . . . . . . . . . . . 8 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9 Legal information. . . . . . . . . . . . . . . . . . . . . . . 10 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Contact information. . . . . . . . . . . . . . . . . . . . . 10 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'. (c) NXP B.V. 2009. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 21 July 2009 Document identifier: PMBT3904M_1 |
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